光：科学与应用（英文版）2026，Vol.15Issue(1)：70-118,49.DOI:10.1038/s41377-025-02048-w
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Drew Weninger 1Samuel Serna 2Luigi Ranno 3Lionel Kimerling 4Anuradha Agarwal5
作者信息
- 1. Materials Research Laboratory,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA||Physical Measurement Laboratory,National Institute of Standards and Technology,100 Bureau Dr,Gaithersburg 20899 MD,USA
- 2. Department of Physics,Photonics,and Optical Engineering,Bridgewater State University,131 Summer St,Bridgewater 02324 MA,USA
- 3. Department of Materials Science and Engineering,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA||Ayar Labs,695 River Oaks Pkwy,San Jose 95134 CA,USA
- 4. Department of Materials Science and Engineering,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA
- 5. Materials Research Laboratory,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA
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Drew Weninger,Samuel Serna,Luigi Ranno,Lionel Kimerling,Anuradha Agarwal..Advances in waveguide to waveguide couplers for 3D integrated photonic packaging[J].光：科学与应用（英文版）,2026,15(1):70-118,49.基金项目
This work was supported by NSF Convergence Accelerator Track I:FUTUR-IC:A Resource-Efficient Microchip Manufacturing and Operations Research Alliance,Award Number ITE-2345076. （）
