粉末冶金技术2026，Vol.44Issue(1)：25-31,7.DOI:10.19591/j.cnki.cn11-1974/tf.2024080011
铜-金刚石复合材料制备方法与性能
Preparation method and properties of copper-diamond composites
摘要
Abstract
Addressing the current issues of insufficient thermal conductivity and low heat dissipation efficiency in electronic packaging materials,the copper-diamond composites were prepared with three different methods,namely,traditional powder metallurgy(PM),stirring friction processing(FSP),and spark plasma sintering(SPS),the microstructure,relative density,interfacial state,and thermal conductivity were comparatively analyzed.The results show that the copper-diamond composites with 50％diamond(volume fraction)prepared by SPS under the sintering pressure of 30 MPa at the holding temperature of 900 ℃ for 20 min have the best performance with the diamond particles uniformly distributed on the copper matrix.The relative density,thermal conductivity,and coefficient of thermal expansion of the SPS composites is 97.4％,517.04 W·m-1·K-1,and 6.63×10-6 K-1,respectively,and there is a transition layer with a thickness of less than 1 μm at the interface,which shows good bonding quality.The performance of the copper-diamond composites prepared by PM is the second,and that of the composites prepared by FSP is the worst.关键词
铜-金刚石复合材料/粉末冶金/搅拌摩擦加工/放电等离子烧结/制备方法/物理性能Key words
copper-diamond composites/powder metallurgy/stir friction processing/spark plasma sintering/preparation method/physical properties分类
矿业与冶金引用本文复制引用
余田亮,陈文革,焦栋茂,牟春浩,马江江..铜-金刚石复合材料制备方法与性能[J].粉末冶金技术,2026,44(1):25-31,7.基金项目
陕西省重点研发项目(2023-YF-YBGY-1616) （2023-YF-YBGY-1616）
西安市硬科技攻关项目(2024JH-CLYB-0034) （2024JH-CLYB-0034）
西安市碑林区技术研发项目(GX2452) （GX2452）
