科技创新与应用2026，Vol.16Issue(7)：35-38,43,5.DOI:10.19981/j.CN23-1581/G3.2026.07.008
横向多芯片组件传热性能优化设计
摘要
Abstract
As chip power and chip density increase,the heat generation of multi-chip module(MCM)technology becomes larger and larger.Therefore,heat transfer analysis for multi-chip modules becomes very important.This paper takes 2×2 multi-chip LED modules as the research object to study the influence of chip layout and packaging parameters on chip junction temperature.The best chip layout method and the most economical packaging parameters are explored.It is concluded that increasing the substrate thermal conductivity,substrate thermal conductivity and substrate bottom equivalent convective heat transfer coefficient are all conducive to reducing chip junction temperature,and the substrate bottom equivalent convective heat transfer coefficient is the main factor affecting chip junction temperature.Finally,the best packaging parameters were used to compare the junction temperature of the MCM-LED chip before and after overall optimization.It was concluded that the junction temperature of the optimized chip was significantly reduced,with the maximum decrease of 37.48%.关键词
横向多芯片组件/传热性能优化/芯片布局优化/封装参数优化/芯片结温Key words
lateral multi-chip module(MCM)/heat transfer performance optimization/chip layout optimization/packaging parameter optimization/chip junction temperature分类
信息技术与安全科学引用本文复制引用
汪永超,李宏城,黄学飞,王钰妍..横向多芯片组件传热性能优化设计[J].科技创新与应用,2026,16(7):35-38,43,5.基金项目
2023年广东省教育厅高等学校科研平台和项目-青年创新人才类项目(2023KQNCX210) （2023KQNCX210）
2024年广州番禺职业技术学院校级科研平台项目(2024KYPT01) （2024KYPT01）
2023年广州番禺职业技术学院校级科研项目(2023KJ20) （2023KJ20）
