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Optimization and defect control in photoresist etch back processes for advanced semiconductor technologies

Ting Lei Zhehong Liu Zhiwen Liu Guangjie Xue Chun Sun Jun Zhou Xiangshui Miao

半导体学报(英文版)2026,Vol.47Issue(3):38-45,8.
半导体学报(英文版)2026,Vol.47Issue(3):38-45,8.DOI:10.1088/1674-4926/25070024

Optimization and defect control in photoresist etch back processes for advanced semiconductor technologies

Optimization and defect control in photoresist etch back processes for advanced semiconductor technologies

Ting Lei 1Zhehong Liu 2Zhiwen Liu 2Guangjie Xue 2Chun Sun 2Jun Zhou 2Xiangshui Miao3

作者信息

  • 1. College of Integrated Circuits,Huazhong University of Science and Technology,Wuhan 430000,China||Wuhan Xinxin Semiconductor Manufacturing Corporation,Wuhan 430000,China
  • 2. Wuhan Xinxin Semiconductor Manufacturing Corporation,Wuhan 430000,China
  • 3. College of Integrated Circuits,Huazhong University of Science and Technology,Wuhan 430000,China
  • 折叠

摘要

关键词

PREB/dummy poly remove/horn height/pattern loading effect

Key words

PREB/dummy poly remove/horn height/pattern loading effect

引用本文复制引用

Ting Lei,Zhehong Liu,Zhiwen Liu,Guangjie Xue,Chun Sun,Jun Zhou,Xiangshui Miao..Optimization and defect control in photoresist etch back processes for advanced semiconductor technologies[J].半导体学报(英文版),2026,47(3):38-45,8.

半导体学报(英文版)

1674-4926

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