舰船电子工程2026，Vol.46Issue(1)：129-133,5.DOI:10.3969/j.issn.1672-9730.2026.01.026
应用于MEMS压力传感器的焊料键合可靠性分析
Analysis of Solder Bonding Reliability Applied to MEMS Pressure Sensors
摘要
Abstract
To meet the high reliability requirements for bonding in MEMS pressure sensor chips,a SnAgCu solder bonding process based on the metal eutectic bonding principle is designed.This article presents the design of the metal transition layer,prep-aration procedures,and bonding process for the sensor chip,followed by the completion of chip preparation.To investigate the reli-ability of the solder bonding,this paper conducts experiments to analyze the bonding interface,shear strength,thermal cycle reli-ability,and electrical performance.The results indicate that the average shear force is 100.80 N,meeting the requirements of GJB548B-2005.Furthermore,after undergoing thermal cycle testing,the shear strength remains virtually unchanged.Additionally,the resistance change rate of the sensor chip is minimal after bonding.In conclusion,SnAgCu solder bonding exhibits excellent reli-ability,providing a valuable reference for the bonding and packaging of MEMS pressure sensors.关键词
压力传感器/焊料键合/可靠性分析/MEMSKey words
pressure sensor/solder bonding/reliability analysis/MEMS分类
信息技术与安全科学引用本文复制引用
范慧榕,王俊强,李鹏程,高经武..应用于MEMS压力传感器的焊料键合可靠性分析[J].舰船电子工程,2026,46(1):129-133,5.基金项目
山西省基础研究计划自然科学研究面上项目(编号:202203021221105)资助. （编号:202203021221105）
