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纳米银键合的石墨烯压力传感器可靠性研究

张昕 王俊强 曹咏弘

舰船电子工程2026,Vol.46Issue(1):134-138,5.
舰船电子工程2026,Vol.46Issue(1):134-138,5.DOI:10.3969/j.issn.1672-9730.2026.01.027

纳米银键合的石墨烯压力传感器可靠性研究

Reliability Study of Graphene High Temperature Pressure Sensor Based on Nanosilver Bonding

张昕 1王俊强 1曹咏弘2

作者信息

  • 1. 中北大学仪器与电子学院 太原 030051||中北大学前沿交叉科学研究院 太原 030051
  • 2. 中北大学前沿交叉科学研究院 太原 030051
  • 折叠

摘要

Abstract

With the rapid development of MEMS sensor devices,the reliability problem has gradually become a critical issue for the application of MEMS sensor devices in military and other fields.In order to systematically study the reliability and stability of graphene high-temperature pressure sensors in harsh environments such as high temperature and high humidity for a long period of time,the quality of nanosilver bonding of graphene high-temperature pressure sensors and the reliability of sensors are evaluated from the aspects of high-temperature thermal storage,temperature and humidity cycling and other environmental loads in the con-text of the sensor device's working environment,respectively.The results of the high-temperature thermal storage experiments show that the nanosilver bonding shear strength is slightly reduced,and the airtightness is better than before.In addition,the results of long-term stability experiments showed that the fundamental resistance of the sensor did not change significantly.Therefore,the nanosilver bonding has better strength and airtightness,which makes the sensor still perform well under different loading environ-ments.This study can illustrate that the nanosilver bonding can be applied in complex and harsh environments such as high tempera-ture and high humidity,which lays the foundation for the application of graphene high-temperature pressure sensors in complex en-vironments such as high temperature and high humidity.

关键词

石墨烯/纳米银键合/可靠性

Key words

graphene/nanosilver bonding/reliability

分类

信息技术与安全科学

引用本文复制引用

张昕,王俊强,曹咏弘..纳米银键合的石墨烯压力传感器可靠性研究[J].舰船电子工程,2026,46(1):134-138,5.

基金项目

山西省基础研究计划自然科学研究面上项目(编号:202203021221105)资助. (编号:202203021221105)

舰船电子工程

1672-9730

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