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Hierarchical Manufacturing of Anisotropic and High-Efficiency Electromagnetic Interference Shielding Modules for Smart Electronics

Shaohong Shi Siwen Deng Yuheng Jiang Jiabin Chen Lukas Sporrer Fangchao Cheng Quanquan Guo Jingjing Jing Yinghong Chen

纳微快报（英文）2026，Vol.18Issue(6)：125-139,15.

纳微快报（英文）2026，Vol.18Issue(6)：125-139,15.DOI:10.1007/s40820-025-02024-4

Hierarchical Manufacturing of Anisotropic and High-Efficiency Electromagnetic Interference Shielding Modules for Smart Electronics

Shaohong Shi ¹Siwen Deng ²Yuheng Jiang ²Jiabin Chen ²Lukas Sporrer ³Fangchao Cheng ²Quanquan Guo ³Jingjing Jing ⁴Yinghong Chen⁴

作者信息

1. Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials,School of Resources,Environment and Materials,Guangxi University,No.100,Daxuedong Road,Nanning 530004,People's Republic of China||State Key Laboratory of Polymer Materials Engineering,Polymer Research Institute of Sichuan University,Sichuan University,No.24 South Section 1,Yihuan Road,Chengdu 610065,People's Republic of China
2. Guangxi Key Laboratory of Processing for Non-ferrous Metals and Featured Materials,School of Resources,Environment and Materials,Guangxi University,No.100,Daxuedong Road,Nanning 530004,People's Republic of China
3. Max Planck Institute of Microstructure Physics,Weinberg 2,06120 Halle(Saale),Germany
4. State Key Laboratory of Polymer Materials Engineering,Polymer Research Institute of Sichuan University,Sichuan University,No.24 South Section 1,Yihuan Road,Chengdu 610065,People's Republic of China
折叠

摘要

关键词

3D printing/Graphene nanoparticles/Hierarchical manufacturing/Electromagnetic interference shielding/Thermal management

Key words

3D printing/Graphene nanoparticles/Hierarchical manufacturing/Electromagnetic interference shielding/Thermal management

引用本文复制引用

Shaohong Shi,Siwen Deng,Yuheng Jiang,Jiabin Chen,Lukas Sporrer,Fangchao Cheng,Quanquan Guo,Jingjing Jing,Yinghong Chen..Hierarchical Manufacturing of Anisotropic and High-Efficiency Electromagnetic Interference Shielding Modules for Smart Electronics[J].纳微快报（英文）,2026,18(6):125-139,15.

基金项目

This work is financially supported by the National Natural Science Foundation of China(52303036),the Natural Science Foundation of Guangxi Province(2024GXNS-FBA010123),the International Science & Technology Innova-tion Cooperation Project of Sichuan Province(2024YFHZ0232),the International Science & Technology Cooperation Project of Chengdu(2021-GH03-00009-HZ),and the Opening Project of State Key Laboratory of Polymer Materials Engineering(Sichuan University)(Sklpme2023-3-18). （52303036）

纳微快报（英文）

ISSN：2311-6706

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