太赫兹科学与电子信息学报2026，Vol.24Issue(2)：258-263,6.DOI:10.11805/TKYDA2025193
面向太赫兹芯片波导封装的智能化设计
A design of intelligent chip packaging simulation for terahertz components
摘要
Abstract
Terahertz chip packaging systems impose stringent requirements on waveguide cavities in terms of miniaturization,high performance,and precision manufacturing.These demands pose significant challenges for the circuit design of the packaging cavity.Traditional design methods rely on manual modeling and parameter tuning,which are time-consuming and inefficient,and struggle to meet the needs of complex structures and multi-objective optimization.This paper proposes an efficient intelligent algorithm based on scripting interfaces of electromagnetic simulation software.The framework enables rapid modeling,performance simulation,and automated optimization of terahertz waveguide cavities.The effectiveness and feasibility of the proposed method are demonstrated through the design and optimization of a Y-band power amplifier cavity.The approach enables efficient and intelligent design of complex waveguide cavities for terahertz chip packaging and holds great promise for applications in high-speed communications,radar systems,and advanced packaging technologies.关键词
太赫兹芯片封装/波导腔体/智能建模/自动优化/电磁仿真Key words
terahertz chip packaging/waveguide cavity/intelligent modeling/automated optimization/electromagnetic simulation分类
信息技术与安全科学引用本文复制引用
杨坤骏,蒋均,黄昆,周人,杨昊,李若雪,陈鹏,严小龙,卢笑池..面向太赫兹芯片波导封装的智能化设计[J].太赫兹科学与电子信息学报,2026,24(2):258-263,6.基金项目
国家自然科学基金资助项目(12327808) （12327808）
国家重点研发计划资助项目(2023YFB3207801 （）
2023YFF0722303) （）
国家重大科研仪器研制资助项目 （）
中国工程物理研究院院长基金资助项目(YZJJZC2022001 （）
YZJJZL2025088) （）
