应用化学2026，Vol.43Issue(3)：411-421,11.DOI:10.19894/j.issn.1000-0518.250353
低介电常数光敏聚酰亚胺工艺制程与性能
Research on the Process and Performance of Low Dielectric Constant Photosensitive Polyimide
摘要
Abstract
Photosensitive polyimide(PSPI)has important applications in high-density integrated circuits and advanced packaging.Reducing the dielectric constant and dielectric loss of PSPI can effectively reduce signal delay and signal loss during high-frequency high-speed transmission.This paper systematically studies the structural design of low-dielectric-loss photosensitive polyimide and the effects of its light curing and thermal curing processes on its dielectric properties.By manipulating the fluorine-containing groups and alicyclic structures,a series of PSPI with low dielectric constant and low dielectric loss were designed.It reveals the different impacts of various thermal curing temperatures(200～350 ℃)and different processing techniques such as post-light curing and then thermal curing on the dielectric constant and dielectric loss of PSPI.Experimental results show that with high-temperature thermal curing alone,the dielectric constant(Dk)and dielectric loss(Df)of PSPI decrease with increasing curing temperature(Dk=3.1～2.6,200～350 ℃),while samples that are light cured and then thermally cured can also achieve low dielectric constants(Dk=3.0～2.4,200～350 ℃)and low dielectric loss,while maintaining excellent mechanical properties and thermal stability.This study provides a theoretical basis for the structural design and application of high-performance low-dielectric-loss PSPI.关键词
光敏聚酰亚胺/光固化/热固化/介电性能Key words
Photosensitive polyimide/Photopolymerization/Thermosetting/Dielectric properties分类
化学化工引用本文复制引用
时舜,马姣姣,李泽宇,张春华,郭海泉..低介电常数光敏聚酰亚胺工艺制程与性能[J].应用化学,2026,43(3):411-421,11.基金项目
国家重点研发计划项目(No.2022YFB3806600)和广州市科技计划项目(No.202206070002)资助 Supported by the National Key Research and Development Program(No.2022YFB3806600)and Guangzhou Science and Technology Program Project(No.202206070002) （No.2022YFB3806600）
