激光清洗技术在芯片封装模具中的应用
Application of laser cleaning technology in chip packaging molds
摘要
Abstract
Laser cleaning technology,as an efficient and environmentally friendly surface treatment method,plays significant application potential in the field of chip packaging molds cleaning.This research systematic-ally investigated the effects of laser parameters(pulse duration,repetition rate,average power)on the clean-ing effect of Epoxy Molding Compound(EMC)contaminates from mold surface coated with chromium on P20 alloy and ASP23 alloy substrates.The experiment employed a 1064 nm Nd-doped pulsed laser,reshap-ing the Gaussian beam into a flat-top beam,and combining with a"bow"shape scanning path of the galvano-meter mirror.The process parameters were optimized using a single-variable method.The experimental res-ults indicate that when the laser energy density is in 0.55-0.77 J/cm2,the pulse duration and repetition rate need to be adjusted in coordination to balance the thermal input,enabling complete removal of contaminants without any damage to the substrate.Parameter sensitivity analysis reveals that the optimal duty cycle range is from 0.8％to 1.0％.Furthermore,when the power exceeds the threshold(150 ns@50％average power or 200 ns@50％average power),it may cause damage to the substrate,which indicates that laser parameter matching is crucial for the cleaning effect and material protection.This research provides a high-precision,non-contact and environmentally friendly cleaning solution for chip packaging molds,and verifies the feasib-ility of laser cleaning technology in the field of integrated circuits.关键词
激光清洗技术/芯片封装模具/占空比/表面处理Key words
laser cleaning technology/chip packaging mold/duty cycle/surface treatment分类
信息技术与安全科学引用本文复制引用
杨金芳,李泽靖,令维军,何涛涛,安浦瑞,杨沛年,袁诗超,毕超,田新叶,汪满,张进兵..激光清洗技术在芯片封装模具中的应用[J].中国光学（中英文）,2026,19(1):49-59,11.基金项目
国家自然科学基金(No.62405221,No.62165012) （No.62405221,No.62165012）
甘肃省高校产业支撑计划项目(No.2024CYZC-44) （No.2024CYZC-44）
甘肃省重点人才项目(No.2025RCXM023) （No.2025RCXM023）
甘肃省高校科研创新平台重大培育项目(No.2024CXPT-12) （No.2024CXPT-12）
天水市强科技奖补专项项目(No.TS-STK-2024A-277) （No.TS-STK-2024A-277）
秦州区科技计划项目(No.2024-SHFZG-8159) （No.2024-SHFZG-8159）
甘肃省科技计划基础研究计划项目(No.25JRRE009,No.25JRZE003,No.25JRRE003) （No.25JRRE009,No.25JRZE003,No.25JRRE003）
甘肃省高校研究生创新之星项目(No.2025CXZX-985) （No.2025CXZX-985）
天水师范大学研究生创新引导立项项目(No.TYCX2441)Supported by National Natural Science Foundation of China(No.62405221,No.62165012) （No.TYCX2441）
Gansu Province University Industry Support Plan Project(No.2024CYZC-44) （No.2024CYZC-44）
Key Talent Project of Gansu Province(No.2025RCXM023) （No.2025RCXM023）
Major Cultivation Project of University Research and Innovation Platform of Gansu Provin-cial Department of Education(No.2024CXPT-12) （No.2024CXPT-12）
Tianshui Strong Science and Technology Award Special Project(No.TS-STK-2024A-277) （No.TS-STK-2024A-277）
Qinzhou District Science and Technology Plan Project(No.2024-SHFZG-8159) （No.2024-SHFZG-8159）
Basic Research Program of Gansu Provincial Science and Technology Plan(No.25JRRE009,No.25JRZE003,No.25JRRE003) （No.25JRRE009,No.25JRZE003,No.25JRRE003）
Gansu Province University Graduate Student Innovation Star Project(No.2025CXZX-985) （No.2025CXZX-985）
Postgraduate Research Innovation Guiding Project of Tianshui Normal University(No.TYCX2441) （No.TYCX2441）
