化工进展2026，Vol.45Issue(4)：2159-2182,24.DOI:10.16085/j.issn.1000-6613.2025-0640
微米铜粉的制备及其在柔性电子领域的应用
Preparation of micron copper powder and its application in the field of flexible electronics
摘要
Abstract
Micron copper powder is a metallic material characterized by excellent electrical and thermal conductivity,good processability and chemical stability.Owing to its diverse morphological features,it can be formulated into conductive pastes and transferred onto flexible substrates via screen printing,inkjet printing and other techniques to fabricate flexible conductive circuits.These properties make it highly suitable for applications in flexible displays,wearable sensors and flexible solar cells.This review summarized the preparation methods and characteristics of micron-sized copper powder,presenting recent research progress and application developments both domestically and internationally.It focused on its utilization in wearable electronics,flexible sensors and electromagnetic shielding films within the field of flexible electronics.Furthermore,the challenges related to morphology control,growth mechanisms and oxidation resistance were critically analyzed.Finally,the review outlined future research directions,emphasizing the need for environmentally friendly strategies to produce micron copper powders with high sphericity,good dispersibility and narrow particle size distribution.In light of the growing demand for flexible electronics,expanding the application landscape of micron-sized copper powder was also expected to become a significant focus in future studies.关键词
微米铜粉/导电浆料/形貌控制/柔性电子/应用市场Key words
micron copper powder/conductive paste/morphology control/flexible electronics/application market分类
化学化工引用本文复制引用
闫月婷,侯和平,党蕊,王晓坤,王远洋..微米铜粉的制备及其在柔性电子领域的应用[J].化工进展,2026,45(4):2159-2182,24.基金项目
陕西省三秦英才特支计划青年拔尖人才配套项目. （）
