能源工程2026，Vol.46Issue(2)：11-18,8.DOI:10.16189/j.nygc.2026.02.002
合金相变材料封装结构对电子芯片散热器性能的影响
Influence of alloy phase change material package structure on the performance of electronic chip heat sinks
陆冰冰 1卜凯阳 1李楚杉 1王伟烈1
作者信息
- 1. 浙江大学伊利诺伊厄巴纳香槟校区联合学院,浙江 嘉兴 314499
- 折叠
摘要
Abstract
This study investigates the cooling performance of In-Bi alloy phase change material(PCM)heat sinks for electronic chips with transient high heat generation.Three packaging configurations with varying PCM filling ratios(20%,30%and 50%)of In-Bi alloy PCM were designed and tested over 10-second heating cycles.Experimental results demonstrate that the cooling efficiency does not correlate linearly with PCM filling ratio.Instead,the PCM heat exchange area significantly impacts heat absorption efficiency.A simulation model was developed to analyze the influence of critical parameters,including heat power,thermal resistance and convective heat transfer coefficients,on cooling performance.The results provide valuable insights for optimizing PCM-based cooling solutions in electronic devices,especially under short-term high power conditions.关键词
相变材料/铟铋合金/电子芯片散热/瞬时高热功率Key words
PCM/In-Bi alloy/electronic cooling/transient high power overload分类
信息技术与安全科学引用本文复制引用
陆冰冰,卜凯阳,李楚杉,王伟烈..合金相变材料封装结构对电子芯片散热器性能的影响[J].能源工程,2026,46(2):11-18,8.
