铜业工程Issue(2)：55-65,11.DOI:10.3969/j.issn.1009-3842.2026.02.006
高热稳定性石墨烯包覆细晶铜复合材料的研制
Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites
摘要
Abstract
The poor thermal stability of metallic copper limits its applications.This study fabricated graphene-encapsulated fine-grained copper composites via chemical vapor deposition(CVD)and investigated graphene growth on fine-grained copper(about 1 μm diameter).Results showed that pure copper's grain size increased from 2.03 μm(600℃)to 18.2 μm(1000℃),with hardness decreasing from 91.56HV to 27.64HV.Interestingly,graphene-encapsulated composites maintained stable grain size distribution(1.25～1.35 μm)and hardness distribution(83.96～100.63HV)across the different temperatures.These findings demonstrated that the graphene encapsulation on fine-grained copper significantly enhanced thermal stability by inhibiting copper atom diffusion.Furthermore,the drawn composite wires fabricated from the graphene-encapsulated copper composites by annealing at 1000℃showed a 53.9%increase in hardness,a 12%improvement in tensile strength,a 29.8%higher elongation,and a 6.8%reduction in electrical resistivity compared with the counterpart produced from pure copper.This work provided new insights for fabricating copper-based composites with superior thermal stability.关键词
细晶铜/石墨烯/铜基复合材料/热稳定性/原子扩散/力学性能/电学性能Key words
fine-grained copper/graphene/copper-based composite/thermal stability/atomic diffusion/mechanical property/electrical property分类
通用工业技术引用本文复制引用
陶慧龙,白金,环瑀淳,王敏..高热稳定性石墨烯包覆细晶铜复合材料的研制[J].铜业工程,2026,(2):55-65,11.基金项目
中央高校基本科研业务费-青年科技创新基金(理工军口类)项目(NT2024015) （理工军口类）
南京航空航天大学科研人才启动基金项目(YAH20033)资助 （YAH20033）
