摩擦（英文）2026，Vol.14Issue(4)：19-29,11.DOI:10.26599/FRICT.2025.9441104
A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing:Shear slipping
A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing:Shear slipping
摘要
关键词
chemical mechanical polishing(CMP)/layered material/bismuth/material removal mode/shear slippingKey words
chemical mechanical polishing(CMP)/layered material/bismuth/material removal mode/shear slipping引用本文复制引用
Yushan Chen,Liuyue Xu,Yuan Wu,Liao Zhou,Yuting Wei,Zihan Zheng,Hui Li,Liang Jiang,Linmao Qian..A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing:Shear slipping[J].摩擦（英文）,2026,14(4):19-29,11.基金项目
The authors are grateful for the financial support from the National Natural Science Foundation of China(Nos.51991373 and 52235004),the National Key R&D Program of China(No.2020YFA0711001),and the Fundamental Research Funds for the Central Universities(Nos.2682025CG001 and 2682024CG007). （Nos.51991373 and 52235004）
