西南交通大学学报2026，Vol.61Issue(3)：806-832,27.DOI:10.3969/j.issn.0258-2724.20260117
光电融合集成与通信感知技术
Multiplex Integration of Photonics&Electronics and Applications in Communication&Sensing
摘要
Abstract
Driven by the rapid advancement of broadband communications,artificial intelligence,and satellite internet,global data traffic is growing exponentially,while conventional electronic integration is approaching physical limits in bandwidth,power consumption,and latency.Photonics-electronics multiplex integration,leveraging multi-dimensional synergy across the full hierarchy from materials and devices to chips and systems,transcends the bandwidth and power constraints of all-electronic architectures and is emerging as a key enabling technology for next-generation information systems.A systematic review of recent advances in photonics-electronics multiplex integration was presented.Its conceptual framework and developmental trends were first delineated,followed by a survey of high-fidelity simulation technologies that bridge link-level systems and chip-scale implementations,with particular emphasis on the state of the art in heterogeneous integration processes,core devices,and system-on-chip architectures.Representative applications in high-speed communications and intelligent sensing were subsequently examined,followed by a forward-looking discussion of future trajectories toward space,air,and ground integrated networks and AI computing clusters.Three grand challenges that must be addressed were further identified,namely the limits of multi-physics coupling,cross-scale manufacturing consistency,and intelligent adaptive control,and a phased breakthrough roadmap was proposed.These offer strategic insights for ubiquitous 6G coverage and the sustainable evolution of computing networks.关键词
光电融合集成/通信感知一体化/光电集成芯片Key words
photonics-electronics multiplex integration/communication-sensing convergence/optoelectronic integrated chip分类
信息技术与安全科学引用本文复制引用
闫连山,邹喜华,潘炜,祝宁华,谢小军,陈建平,周林杰,裴丽,延凤平,岳洋,叶佳,邓雄..光电融合集成与通信感知技术[J].西南交通大学学报,2026,61(3):806-832,27.基金项目
国家重点研发计划(2019YFB1803500,2019YFB2203200,2021YFB2800900,2021YFB2801300,2022YFB2803800,2023YFB2804900,2024YFE0212100) （2019YFB1803500,2019YFB2203200,2021YFB2800900,2021YFB2801300,2022YFB2803800,2023YFB2804900,2024YFE0212100）
国家自然科学基金项目(61335005,6243000320,62431024,U21A20507,U22A2089,U23A20376,U25A20524) （61335005,6243000320,62431024,U21A20507,U22A2089,U23A20376,U25A20524）
