集成电路与嵌入式系统2026，Vol.26Issue(6)：1-9,9.DOI:10.20193/j.ices2097-4191.2025.0145
FC-CCGA封装可靠性分析与寿命预测
Thermal reliability analysis and solder fatigue life prediction of high reliability FC-CCGA packaging
蒋尚 1李文昌 2刘喆 2刘剑 3苏承欣4
作者信息
- 1. 中国科学院半导体研究所 固态光电信息技术实验室,北京 100083||中国科学院大学,北京 100049||北京轩宇空间科技有限公司,北京 100086
- 2. 中国科学院半导体研究所 固态光电信息技术实验室,北京 100083||中国科学院大学,北京 100049
- 3. 中国科学院半导体研究所 半导体芯片物理与技术全国重点实验室,北京 100083||中国科学院大学,北京 100049
- 4. 北京轩宇空间科技有限公司,北京 100086
- 折叠
摘要
Abstract
As electronic packaging technology advances towards high-density and highly integrated configurations,FC-CCGA packages are increasingly adopted in aerospace and other high-reliability applications due to their superior electrical and thermal performance and I/O density.These packages must withstand vibrational loads during launch and thermal cycling during in-orbit operation,with their core interconnect components susceptible to stress accumulation leading to thermomechanical fatigue failure,directly threatening the re-liability and lifespan of the package devices.This study,based on the Anand model,constructs a comprehensive electro-mechanical 3D model encompassing chip bumps,solder columns,epoxy resin,and PCB substrate,systematically investigating the vibration and ther-mal fatigue reliability of FC-CCGA solder joints and bumps.The analysis includes impact response spectrum assessments pre-electrical and post-electrical reinforcement,simulating the stress-strain response of critical solder joints and bumps under thermal cycling loads,and evaluating the plastic strain distribution and evolution over time.Additionally,the Coffin-Manson model is employed to predict the thermo-mechanical fatigue life of the solder joints and bumps.Temperature cycling tests on packaged devices were conducted,observing morphological changes in solder joints at varying cycle counts.The experimental results align with simulation predictions,providing a theoretical basis and methodological support for optimizing solder joint structures and assessing their lifespan for high-reliability applications.关键词
FC-CCGA封装/温度循环/疲劳寿命/可靠性分析/寿命预测Key words
FC-CCGA packaging/temperature cycle/fatigue life/reliability analysis/life prediction分类
信息技术与安全科学引用本文复制引用
蒋尚,李文昌,刘喆,刘剑,苏承欣..FC-CCGA封装可靠性分析与寿命预测[J].集成电路与嵌入式系统,2026,26(6):1-9,9.
