红外技术2026，Vol.48Issue(5)：630-635,6.
复合材料蜂窝夹层结构粘接缺陷红外对侧穿透式检测技术
Opposite-Side Transmission Infrared Thermography Technology for Bonding Defects in Composite Honeycomb Sandwich Structures
林鑫 1严凡 1马兆庆 1高晨家 1袁生平1
作者信息
- 1. 航天材料及工艺研究所,北京 100076
- 折叠
摘要
Abstract
In single-sided infrared thermography,thermal waves must propagate from the specimen surface to the defect and back,traveling twice the defect depth.This results in severe attenuation and limits the detection depth.To overcome this limitation,this study proposes an opposite-side infrared detection scheme based on high-power thermal excitation with a heat source and an infrared camera placed on opposite sides of the specimen.Experiments were conducted on a composite honeycomb sandwich structure with a layup of 2 mm/28 mm/2 mm,and thermal excitation parameters,including heating power,duration,and acquisition delay,were optimized.The results show that in opposite-side detection,thermal waves travel only one way from the defect to the camera-side surface,enabling clear identification of internal and back-side debonding defects,with a detection sensitivity of 100%for Φ10 mm defects.Therefore,opposite-side transmission infrared detection effectively overcomes the depth attenuation issue caused by round-trip thermal wave propagation in single-sided detection,thereby providing an efficient and reliable method for defect detection in thick-composite honeycomb structures.关键词
红外对侧检测/蜂窝夹层结构/脱粘缺陷Key words
transmission thermography/composite honeycomb/disbond defect分类
信息技术与安全科学引用本文复制引用
林鑫,严凡,马兆庆,高晨家,袁生平..复合材料蜂窝夹层结构粘接缺陷红外对侧穿透式检测技术[J].红外技术,2026,48(5):630-635,6.
