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基于High-K电介质的低高频优值4H-SiC MOSFET设计

陈家兴 李俊焘 张林

太赫兹科学与电子信息学报2026,Vol.24Issue(5):603-610,8.
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太赫兹科学与电子信息学报2026,Vol.24Issue(5):603-610,8.DOI:10.11805/TKYDA2025026

基于High-K电介质的低高频优值4H-SiC MOSFET设计

A low High-Frequency Figure Of Merit 4H-SiC MOSFET based on High-K dielectric

陈家兴 1李俊焘 1张林1

作者信息

  • 1. 中国工程物理研究院 电子工程研究所,四川 绵阳 621999||中国工程物理研究院微系统与太赫兹研究中心,四川 成都 610200
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摘要

Abstract

One of the research hotspots for Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistors(SiC MOSFETs)is how to reduce the High-Frequency Figure of Merit(HF-FOM).This paper presents a theoretical derivation combined with Technology Computer Aided Design(TCAD)simulation technology to analyze the influence of field plate isolation dielectric materials on device performance.Based on this analysis,we propose a Split-Gate MOSFET(SG MOSFET)structure named HK(High-K)-MOSFET that connects the source field plate with a High-K field plate isolation dielectric.Compared to the HK MOSFET(SiO2)using silicon oxide as the field plate dielectric and the conventional Split Gate structure(SG MOSFET),the gate-drain capacitance(CGD)of the HK-MOSFET(HfO2)using hafnium oxide as the dielectric is reduced by 34.0%and 71.7%,respectively,while the gate-drain charge(QGD)is reduced by 24.5%and 58.9%,respectively.The(HF-FOM)1(CGD×Ronsp)and(HF-FOM)2(QGD×Ronsp)decrease by 71.4%and 60.1%compared to those of the SG-MOSFET.The results indicate that utilizing High-K dielectrics is an effective approach for designing fast switching SiC MOSFET devices.

关键词

High-K电介质/栅漏电荷/栅漏电容/高频优值

Key words

High-K dielectric/gate-drain charge(QGD)/gate-drain capacitance(CGD)/High-Frequency Figure of Merit(HF-FOM)

分类

信息技术与安全科学

引用本文复制引用

陈家兴,李俊焘,张林..基于High-K电介质的低高频优值4H-SiC MOSFET设计[J].太赫兹科学与电子信息学报,2026,24(5):603-610,8.

基金项目

中国工程物理研究院院长基金资助项目(YZJJZQ2023015) (YZJJZQ2023015)

太赫兹科学与电子信息学报

2095-4980

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