铜业工程Issue(3)：33-38,6.DOI:10.3969/j.issn.1009-3842.2026.03.004
泡沫铜/铜网复合梯度均热板的5G散热特性研究
Heat Dissipation Characteristics of Vapor Chambers for 5G Devices with Gradient Wicks Based on Copper Foam/Copper Mesh Composite
摘要
Abstract
This paper innovatively proposed thin vapor chambers based on gradient porosity copper foam/copper mesh composite structure to meet heat dissipation requirements of 5G communication equipment with high power density.Through two-way pore gradient design,thickness of copper foam was compressed from 1.6 mm to 0.15 mm by hot pressing technology at the evaporation end,forming a high-density microporous structure to enhance capillary.The condensation end was configured with 150 μm pore copper mesh to optimize the working medium reflux path,significantly reducing flow resistance.Experimental results showed that the design can reduce temperature fluctuation from 10.3℃to 5.2℃(a decrease of 49%)under a heat load of 65 W,with a thermal resistance(ΔRth)of only 0.08℃/W.In particular,the gradient structure shortened start-up time to 8 s,providing a new idea for heat dissipation of miniaturized electronic devices.This study provided a new paradigm for the miniaturization and heat dissipation of high-power electronic devices,balancing efficient heat transfer and structural reliability.Design concept of the three-stage flow channel(large hole for evaporation end → middle hole for transition layer → small hole for copper mesh)can be extended to other high heat density application scenarios.关键词
高功率密度电子器件/梯度孔隙率泡沫铜/均热板/散热/微孔结构Key words
high-power-density electronics/copper foam with gradient porosity/vapor chamber/thermal management/microporous structure分类
能源科技引用本文复制引用
雷子璇,张文璐,吴胜,张柏文,洪明,陈岩,张海丰..泡沫铜/铜网复合梯度均热板的5G散热特性研究[J].铜业工程,2026,(3):33-38,6.基金项目
赣鄱俊才支持计划-主要学科学术和技术带头人培养项目(20232BCJ22028) （20232BCJ22028）
