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Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip

Ruifeng Li Debo Wang

半导体学报（英文版）2026，Vol.47Issue(6)：94-103,10.

半导体学报（英文版）2026，Vol.47Issue(6)：94-103,10.DOI:10.1088/1674-4926/25120026

Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip

Ruifeng Li ¹Debo Wang¹

作者信息

1. College of Integrated Circuit Science and Engineering,Nanjing University of Posts and Telecommunications,Nanjing 210023,China
折叠

摘要

关键词

MEMS/thermo-electromechanical coupling/sensitivity/microwave power detection/cantilever beam

Key words

MEMS/thermo-electromechanical coupling/sensitivity/microwave power detection/cantilever beam

引用本文复制引用

Ruifeng Li,Debo Wang..Study on the thermo-electromechanical coupling model of the dual-channel microwave power detection chip[J].半导体学报（英文版）,2026,47(6):94-103,10.

基金项目

This work was supported by the National Natural Sci-ence Foundation of China(61904089),the Province Natural Sci-ence Foundation of Jiangsu(BK20190731). （61904089）

半导体学报（英文版）

ISSN：1674-4926

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