计算力学学报2026，Vol.43Issue(3)：354-361,8.DOI:10.7511/jslx20250606001
双层H形分形流道冷却结构性能分析与多目标优化
Heat transfer performance analysis and multi-objective optimization of cooling structure with double-layer H-shaped fractal flow channels
摘要
Abstract
With increasing integration of electronic components,the challenges associated with heat dissipation due to high heat flux density are becoming increasingly significant.Enhancing both the performance and uniformity of heat dissipation can effectively extend the service life of electronic components and improve their performance stability.To address the heat dissipation requirements of densely arranged high-power chips,this paper enhances the double-layer H-shaped fractal microfluidic liquid cold plate,originally designed based on fractal theory,by optimizing its flow channel arrangement to improve heat dissipation uniformity.First,a method to optimize the distribution of local runners is proposed,and several parameters that may influence heat dissipation performance and uniformity are defined.Subsequently,a univariate analysis method is employed to identify three parameters suitable for optimization,which are then utilized as design variables to establish a Kriging response model correlating the objective functions.Finally,the Mantis Search Algorithm(MOMSA)is applied for multi-objective optimization,resulting in the identification of optimized geometric parameters.The results indicate that the maximum temperature(Tmax)and temperature difference(△T)corresponding to the optimized flow channel are reduced by 11.74％and 26.15％,respectively,demonstrating significant optimization effects.This study presents an effective approach for enhancing the heat dissipation performance of fractal flow channels,thereby increasing their applicability under conditions of high heat flux density.关键词
冷却结构/传热/分形流道/多目标优化Key words
cooling structure/heat transfer/fractal channel/multi-objective optimization分类
数理科学引用本文复制引用
范博元,胡靖宇,刘书田..双层H形分形流道冷却结构性能分析与多目标优化[J].计算力学学报,2026,43(3):354-361,8.基金项目
国家自然科学基金(U2341232)资助项目. （U2341232）
