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边缘计算与云计算协同的电子电路数据处理架构

胡乐

科技创新与应用2026,Vol.16Issue(18):104-107,4.
科技创新与应用2026,Vol.16Issue(18):104-107,4.DOI:10.19981/j.CN23-1581/G3.2026.18.024

边缘计算与云计算协同的电子电路数据处理架构

胡乐1

作者信息

  • 1. 西安奇维科技有限公司,西安 710000
  • 折叠

摘要

Abstract

This paper proposes an edge-cloud collaborative architecture for electronic circuit data processing.The edge layer enables data acquisition,real-time processing,and local decision-making to effectively reduce system latency,while the cloud layer provides massive data storage,deep analysis,and global optimization capabilities.Through standardized interfaces and communication protocols,the two layers achieve efficient collaboration,forming a fully complementary system.This architecture shows significant advantages in data processing efficiency,system reliability and resource utilization.It can meet the dual needs of real-time and analysis depth in industrial automation and other scenarios,and provides an efficient and reliable solution for electronic circuit data processing.

关键词

边云协同/数据处理/协同架构/效能优化/云计算

Key words

edge-cloud collaboration/data processing/collaborative architecture/efficiency optimization/cloud computing

分类

信息技术与安全科学

引用本文复制引用

胡乐..边缘计算与云计算协同的电子电路数据处理架构[J].科技创新与应用,2026,16(18):104-107,4.

科技创新与应用

2095-2945

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