中国钼业2026，Vol.50Issue(3)：1-10,10.DOI:10.13384/j.cnki.cmi.1006-2602.2026.03.001
钼铜复合材料的研究进展与应用
Research progress and applications of Mo-Cu composite materials
摘要
Abstract
This review summarizes the main fabrication methods and recent research progress of Mo-Cu composites,highlighting the characteristics of different processes and their influence on the microstructure and properties of the materials.Emerging technologies such as nanopowder synthesis and spark plasma sintering are evaluated for their effectiveness in enhancing densification and structural uniformity.The current applications of Mo-Cu composites in electronic packaging substrates,heat sink materials,electrical contacts,shaped charge liners,and aerospace and defense systems are also outlined.Finally,future research is suggested to focus on efficient forming techniques for high-density and complex-shaped components,as well as the integration and optimization of multiple advanced processing routes to achieve further improvements in material performance and broaden engineering applications.关键词
钼铜复合材料/熔渗/活化烧结/超薄板材/电子封装材料Key words
Mo-Cu composite materials/infiltration/activated sintering/ultra-thin sheet/electronic packaging materials分类
矿业与冶金引用本文复制引用
何凯,石明君,安耿,刘仁智,梁靖,成会朝..钼铜复合材料的研究进展与应用[J].中国钼业,2026,50(3):1-10,10.基金项目
国家重点研发计划(编号:2024YFB4608600) （编号:2024YFB4608600）
