无机材料学报2026，Vol.41Issue(6)：831-838,8.DOI:10.15541/jim20250400
3D打印制备CNT/SiC-SiO2及其电磁屏蔽性能
Highly Efficient EMI Shielding via 3D-printed CNT/SiC-SiO2 Architectures
摘要
Abstract
The development of lightweight,mechanically robust,and high-performance electromagnetic interference(EMI)shielding materials is critical for next-generation electronic and communication systems.In this study,we report the design and fabrication of a 3D-printed carbon nanotube/polydimethylsiloxane(CNT/PDMS)composite with tunable composition and hierarchical architecture.The resulting composite exhibits exceptional mechanical resilience,supporting loads up to 250 times its own weight and recovering fully after experiencing 40%strain.During pyrolysis in an inert atmosphere,the PDMS matrix decomposes and transforms into a SiC-SiO2 ceramic phase that encapsulates the CNT network,thereby forming a hierarchically porous,multi-phase architecture.Notably,the CNT/SiC-SiO2 composite demonstrates outstanding EMI shielding effectiveness(SE)of 62.0 dB in the X-band(8-12 GHz),primarily attributed to absorption(SEA=59.91 dB).This elevated absorption capability arises from synergistic effects including improved impedance matching,conduction loss,interfacial/dipole polarization,and multiple internal reflections within the hierarchically porous,multi-interface architecture.The"absorption-reflection-reabsorption"mechanism enables near-complete attenuation of incident electromagnetic waves.This work presents a scalable,3D-printing-enabled strategy for fabricating multifunctional carbon-ceramic composites with superior EMI shielding performance,which can meet the requirement of aerospace,wearable electronics,and military applications.关键词
电磁干扰/3D打印/多孔CNT/SiC-SiO2陶瓷/电磁干扰屏蔽吸收机制Key words
electromagnetic interference(EMI)/3D printing/porous CNT/SiC-SiO2 ceramic/EMI shielding absorption mechanism分类
化学化工引用本文复制引用
王萌萌,田力,张俊敏,李庆刚,杨金山,董绍明..3D打印制备CNT/SiC-SiO2及其电磁屏蔽性能[J].无机材料学报,2026,41(6):831-838,8.基金项目
National Natural Science Foundation of China(52222202,52502107) （52222202,52502107）
Shanghai Pilot Program for Basic Research-Chinese Academy of Science,Shanghai Branch(JCYJ-SHFY-2021-001) （JCYJ-SHFY-2021-001）
