安庆师范大学学报（自然科学版）2026，Vol.32Issue(2)：33-38,6.DOI:10.13757/j.cnki.cn34-1328/n.2026.02.005
非正态下权重累加集成芯片封装质量判断方法
Quality Evaluation Method for Integrated Chip Packaging Test Data under Non-Normal Distribution Using Line Chart Vertex Weight Accumulation
摘要
Abstract
In the early stage of integrated chip(IC)packaging and testing,the limited amount of data often leads to non-normal distribution,making it difficult to evaluate quality using existing process capability indices.This paper proposes a Line Chart Vertex Weight Accumulation Method that does not rely on the mean or variance.By filtering out extreme deviation data points using the 99.73%interval range and replacing the traditional process mean with the weight-accumulated mean of line chart vertices,the method enables accurate quality evaluation of IC packaging without depending on distribution assumptions.Simulation results show that this method provides more stable process capability index calculations compared to other non-nor-mal distribution approaches and can effectively detect quality issues at the early testing stage,thereby reducing packaging and testing costs.关键词
集成芯片/封装质量/折线图顶点权重累加法/过程能力指数/非正态分布Key words
integrated chip/packaging quality/line chart vertex weight accumulation method/process capability index/non-normal distribution分类
信息技术与安全科学引用本文复制引用
张珺瑚,刘建,章礼华,詹文法..非正态下权重累加集成芯片封装质量判断方法[J].安庆师范大学学报（自然科学版）,2026,32(2):33-38,6.基金项目
安徽省高等学校科学研究项目(2023AH050481)和安徽省高等学校质量工程项目(2023zygzts036,2024zybj022) （2023AH050481）
