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首页|期刊导航|材料工程|Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望:从微观界面设计到宏观连接制造

Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望:从微观界面设计到宏观连接制造

李红 金天 潘瑞 熊华平 王义朋 HODÚLOVÁ Erika

材料工程2026,Vol.54Issue(8):53-68,16.
材料工程2026,Vol.54Issue(8):53-68,16.DOI:10.11868/j.issn.1001-4381.2026.000268

Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望:从微观界面设计到宏观连接制造

Research status and prospects of immiscible nano-multilayer films in Cu/refractory metal systems:from microscopic interface design to macroscopic joining manufacturing

李红 1金天 1潘瑞 1熊华平 2王义朋 1HODÚLOVÁ Erika3

作者信息

  • 1. 北京工业大学 材料科学与工程学院,北京 100124
  • 2. 中国航发北京航空材料研究院,北京 100095
  • 3. 斯洛伐克科学院 材料和机械研究所,斯洛伐克 布拉迪斯拉发 84513
  • 折叠

摘要

Abstract

As modern high-end manufacturing increasingly trends towards miniaturization and multifunctionality,achieving high-quality joining of dissimilar materials has encountered severe technical bottlenecks.Addressing this challenge,nano-multilayer films have emerged as a highly promising technological pathway for realizing low-temperature,highly reliable bonding,owing to their pronounced size effects and high-density interfacial structures.This review focuses on immiscible nano-multilayer films of the Cu/X(X=W,V,Mo,Ta,Nb)refractory metal systems,systematically elucidating the thermal stability evolution mechanisms governed by interfacial microstructures,as well as the intrinsic mechanisms that modulate mechanical properties and irradiation responses.Furthermore,it summarizes the recent research progress on their applications as high-performance brazing fillers or interlayers in brazing and diffusion bonding,highlighting their critical roles in mitigating residual stress in joints and suppressing the formation of brittle intermetallic compounds.Finally,it points out that future research should focus on the multi-scale computational modeling of spatial interfacial transport mechanisms and interfacial evolution mechanisms under multi-field coupling.Overcoming the high-temperature thermal stability bottleneck of this system is also identified as a key direction to advance its engineering applications.

关键词

难熔金属/纳米多层膜/元素扩散/界面结构/残余应力/热稳定性

Key words

refractory metal/nano-multilayer film/elemental diffusion/interfacial structure/residual stress/thermal stability

分类

矿业与冶金

引用本文复制引用

李红,金天,潘瑞,熊华平,王义朋,HODÚLOVÁ Erika..Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望:从微观界面设计到宏观连接制造[J].材料工程,2026,54(8):53-68,16.

基金项目

国家自然科学基金(52475316) (52475316)

国家外国专家项目(H20240059) (H20240059)

材料工程

1001-4381

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