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基于激光切割技术疏除猕猴桃花蕾的试验与分析

王琛 张玉飞 唐寅 石复习

中国农机化学报2026,Vol.47Issue(7):71-77,7.
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中国农机化学报2026,Vol.47Issue(7):71-77,7.DOI:10.13733/j.jcam.issn.2095-5553.2026.07.010

基于激光切割技术疏除猕猴桃花蕾的试验与分析

Experiment and analysis of removing kiwifruit flower bud based on laser cutting technology

王琛 1张玉飞 1唐寅 1石复习1

作者信息

  • 1. 西北农林科技大学机械与电子工程学院,陕西 杨凌,712100
  • 折叠

摘要

Abstract

To develop automatic flower thinning and bud thinning equipment that is fast,precise,and requires low labor intensity,and to verify the feasibility of kiwifruit flower bud thinning by laser ablating the flower stalk,this study conducted kiwi flower bud thinning experiments in kiwi orchards using laser technology.The research focused on three kiwi varieties—Xu Xiang,Jin Fu,and Hayward—planted in Meixian County,Shaanxi Province.A diode laser was used to ablate the flower stalk tissue of the kiwi flower buds for the thinning experiment.Growth conditions of the test subjects were photographed and recorded before and 48 hours after the laser treatment,and measurements of flower stalk diameter and ablation depth were taken.Data fitting and multi-factor analysis of variance indicated that a 20 W diode laser with a 1.2 s exposure time(24 J output energy)was most suitable for thinning kiwi flower buds.The study also selected a laser with an oblique incident angle based on its thinning effects and the complex orchard working environment.Additionally,issues faced by laser thinning operations,such as moisture on buds and wind disturbances,were analyzed and discussed.The experiment demonstrated that laser cutting technology is feasible for thinning kiwi flower buds and provides a reference for the development of automatic laser flower and bud thinning equipment.

关键词

激光切割/猕猴桃/疏蕾/全因子试验/果园机械化

Key words

laser cutting/kiwifruit/bud thinning/full factorial experiment/orchard mechanization

分类

农业科技

引用本文复制引用

王琛,张玉飞,唐寅,石复习..基于激光切割技术疏除猕猴桃花蕾的试验与分析[J].中国农机化学报,2026,47(7):71-77,7.

基金项目

陕西省重点产业创新链项目(2024NC—ZDCYL—05-10) (2024NC—ZDCYL—05-10)

中国农机化学报

2095-5553

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