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Preface to the Focus Issue on Pathways to Advanced Flexible Electronics:Materials,Structures,and Systems

Desheng Kong Rongrong Bao La Li Chunfeng Wang Yue Liu

半导体学报(英文版)2026,Vol.47Issue(8):1-4,4.
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半导体学报(英文版)2026,Vol.47Issue(8):1-4,4.DOI:10.1088/1674-4926/26071001

Preface to the Focus Issue on Pathways to Advanced Flexible Electronics:Materials,Structures,and Systems

Preface to the Focus Issue on Pathways to Advanced Flexible Electronics:Materials,Structures,and Systems

Desheng Kong 1Rongrong Bao 2La Li 3Chunfeng Wang 4Yue Liu5

作者信息

  • 1. College of Engineering and Applied Sciences,Nanjing University,Nanjing 210021,China
  • 2. School of Aeronautic Science and Engineering,Beihang University,Beijing 100081,China
  • 3. School of Integrated Circuits and Electronics,Beijing Institute of Technology,Beijing 100081,China
  • 4. College of Materials Science and Engineering,Shenzhen University,Shenzhen 518071,China
  • 5. Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China
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摘要

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Desheng Kong,Rongrong Bao,La Li,Chunfeng Wang,Yue Liu..Preface to the Focus Issue on Pathways to Advanced Flexible Electronics:Materials,Structures,and Systems[J].半导体学报(英文版),2026,47(8):1-4,4.

半导体学报(英文版)

1674-4926

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