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Enhancing crack-based strain sensors for future wearables and robotics

Xing Chen Dongchan Li Desheng Kong

半导体学报(英文版)2026,Vol.47Issue(8):5-9,5.
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半导体学报(英文版)2026,Vol.47Issue(8):5-9,5.DOI:10.1088/1674-4926/26040040

Enhancing crack-based strain sensors for future wearables and robotics

Enhancing crack-based strain sensors for future wearables and robotics

Xing Chen 1Dongchan Li 1Desheng Kong2

作者信息

  • 1. College of Chemical Engineering and Technology,Engineering Research Center of Seawater Utilization Technology of Ministry of Education,State Key Laboratory of Reliability and Intelligence of Electrical Equipment,Hebei University of Technology,Tianjin 300130,China
  • 2. College of Engineering and Applied Sciences,State Key Laboratory of Analytical Chemistry for Life Science,and Jiangsu Key Laboratory of Artificial Functional Materials,Nanjing University,Nanjing 210023,China
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摘要

引用本文复制引用

Xing Chen,Dongchan Li,Desheng Kong..Enhancing crack-based strain sensors for future wearables and robotics[J].半导体学报(英文版),2026,47(8):5-9,5.

基金项目

We acknowledge the support from the National Natural Science Foundation of China(Grant No.62374083). (Grant No.62374083)

半导体学报(英文版)

1674-4926

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