光：科学与应用（英文版）2026，Vol.15Issue(8)：2871-2883,13.DOI:10.1038/s41377-026-02326-1
Thermal Utilization on Chip
Thermal Utilization on Chip
Yaohao Zhang 1Bo Lai 2Fei Yu 3Xuesong Li 3Yue Yang 3Wei Lü 1Ke Jiang 2Xiaojuan Sun 2Dabing Li4
作者信息
- 1. State Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,China||Key Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,China
- 2. State Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,China
- 3. Key Laboratory of Advanced Structural Materials,Ministry of Education and School of Materials Science and Engineering and Advanced Institute of Materials Science,Changchun University of Technology,Changchun,China
- 4. State Key Laboratory of Luminescence Science and Technology,Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun,China||Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing,China
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Yaohao Zhang,Bo Lai,Fei Yu,Xuesong Li,Yue Yang,Wei Lü,Ke Jiang,Xiaojuan Sun,Dabing Li..Thermal Utilization on Chip[J].光：科学与应用（英文版）,2026,15(8):2871-2883,13.基金项目
This work was supported by the National Natural Science Foundation of China(62425408,62121005,62474024,U22A2084),the Youth Innovation Promotion Association of the Chinese Academy of Sciences(2023223). （62425408,62121005,62474024,U22A2084）
