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A Review of Next-Generation Smart Manufacturing Enabled by Engineering Systems,Materials Modeling,and High-Performance Computing:A System-Oriented Perspective for Semiconductor Manufacturing

Hsiao-Chun Han Der-Chen Huang Chin-Ling Chen

Computers, Materials & Continua2026，Vol.89Issue(10)：P.307-404,98.

Computers, Materials & Continua2026，Vol.89Issue(10)：P.307-404,98.DOI:10.32604/cmc.2026.084216

A Review of Next-Generation Smart Manufacturing Enabled by Engineering Systems,Materials Modeling,and High-Performance Computing:A System-Oriented Perspective for Semiconductor Manufacturing

Hsiao-Chun Han ¹Der-Chen Huang ¹Chin-Ling Chen¹

作者信息

1. Department of Applied Artificial Intelligence,Ming Chuan University,Taoyuan City,Taiwan,China 2 Department of Computer Science and Engineering,National Chung Hsing University,Taichung City,Taiwan,China 3 Department of Computer Science and Information Engineering,Chaoyang University of Technology,Taichung City,Taiwan,China
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摘要

关键词

Engineering system analysis/material modeling/high performance computation/digital twin/smart manufacturing/semiconductor/TSMC/automatic control systems/robotic manipulators/automated guided vehicles

分类

信息技术与安全科学

引用本文复制引用

Hsiao-Chun Han,Der-Chen Huang,Chin-Ling Chen..A Review of Next-Generation Smart Manufacturing Enabled by Engineering Systems,Materials Modeling,and High-Performance Computing:A System-Oriented Perspective for Semiconductor Manufacturing[J].Computers, Materials & Continua,2026,89(10):P.307-404,98.

Computers, Materials & Continua

ISSN：1546-2218

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