摘要
Abstract
Cu-based bimetallic nanomultilayers,as a novel class of nanostructured materials whose components and structures can be precisely tailored,exhibit significantly superior mechanical properties and corrosion resistance compared to traditional single-layer films due to their high-density heterogeneous interfaces.Consequently,they demonstrate broad application prospects in high-tech fields such as microelectromechanical systems(MEMS),flexible electronic devices,and surface protection engineering.In recent years,with the continuous advancement of micro-and nanoscale mechanical testing techniques and high-resolution interface characterization methods,researchers have been able to reveal interface effects,size effects,and their intrinsic correlations with macroscopic properties at a more refined structural level.This direction has gradually become a frontier hotspot in materials science.
From the perspective of synergistic regulation of"functional units"and"geometric configurations",the work aims to systematically review recent progress in research on the microstructural evolution mechanisms of Cu-based bimetallic nanomultilayers.It focuses on analyzing the effect of different crystal structure matching on their microstructural characteristics and discusses the critical role of interfacial energy states and lattice mismatch in the growth behavior of the multilayers.From the perspective of component layer matching,the evolution of grain morphology characteristics across multiple layers is investigated,and the formation conditions of polycrystalline lattice structures are systematically summarized.Furthermore,the transformation process of interface structures driven by thermodynamics is elucidated,and an in-depth comparison is made regarding the significant differences in grain morphology,interface structure,energy state,and stability between crystalline/crystalline and crystalline/amorphous multilayers.
On this basis,the evolution of size-dependent mechanical properties is discussed in detail,pointing out that the multilayers exhibit pronounced size effects and characteristics dominated by small-scale interfaces.The strengthening mechanisms governed by interface structures and grain sizes under dimensional constraints are systematically summarized,revealing the synergistic role of grain boundaries and phase boundaries in coordinating the deformation process,and elucidating the intrinsic mechanisms by which the multilayers achieve significantly enhanced mechanical properties at the nanoscale.It is also noted that the introduction of an amorphous phase can significantly alter the strengthening mode,and the crystalline-amorphous composite deformation mechanism is introduced.Meanwhile,it is proposed that the multilayers,relying on their high-density interfacial physical barrier effect and interlayer electrochemical synergy,possess unique advantages in improving corrosion resistance.From the perspective of interface engineering,various optimization strategies for enhancing corrosion resistance are proposed,including introducing metallic elements to form dense passive films,utilizing multilayer interfaces to block the propagation paths of corrosion channels,improving surface hydrophobicity,and incorporating an amorphous phase.
Finally,this work provides an outlook on the future development directions and prospects of Cu-based bimetallic nanomultilayers.It suggests establishing quantitative prediction models that link microstructural parameters(layer thickness,interfacial coherency,grain size,etc.)with macroscopic properties,by combining high-throughput computations and machine learning.Attention should also be paid to the material behavior under severe service environments involving coupled mechanical-electrochemical-chemical multi-fields,so as to provide a scientific basis for designing engineered multilayer materials with high stability and reliability.关键词
Cu基双金属纳米多层膜/微观结构/力学性能/变形机制/耐蚀性Key words
Cu-based bimetallic nanomultilayer films/microstructure/mechanical properties/deformation mechanism/corrosion resistance分类
矿业与冶金
