测控技术2026，Vol.45Issue(9)：60-68,9.DOI:10.19708/j.ckjs.2026.09.304
印制电路板组件装配三维数字化工艺设计研究
Research on 3D Digital Process Planning for Printed Circuit Board Assembly
摘要
Abstract
3D digital process planning is the key to realize real time data linkage across the entire product life-cycle,which plays an important role in improving collaboration efficiency,eliminating data silos,and enhancing document visualization.In the process of printed circuit board assembly(PCBA),the particularity and complex-ity of processes such as reflow soldering and manual soldering make it difficult for the 3D digital process design platform in the mechanical processing industry to be applied to the production and manufacturing of electronic products.To address this problem,the key technologies for achieving digital process planning in the assembly process of PCBA are emphasized,including 3D modeling technology based on OpenGL,reflow soldering simu-lation technology,and process parameter optimization technology based on reinforcement learning.Practice shows that all information required for constructing the 3D model of PCBA can be obtained by parsing design files output by electronic design automation(EDA).Thus,the model can be used as the core carrier through the entire design and manufacturing lifecycle,realizing data-driven full-process dynamic collaboration.关键词
印制电路板组件/数字化工艺设计/OpenGL三维建模/强化学习/工艺优化Key words
PCBA/digital process planning/3D modeling based on OpenGL/reinforcement learning/process optimization分类
信息技术与安全科学引用本文复制引用
杨昌霖..印制电路板组件装配三维数字化工艺设计研究[J].测控技术,2026,45(9):60-68,9.基金项目
国家重点研发计划"高性能计算"重点专项(2025YFB3003401) （2025YFB3003401）
