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550 kV GIL 弹簧触指结构的多物理场耦合分析与优化设计

吴芊婳 杨昊 周福升 高超 丁瑞芳 赵杨震

高压电器2026,Vol.62Issue(9):69-78,10.
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高压电器2026,Vol.62Issue(9):69-78,10.DOI:10.13296/j.1001-1609.hva.2026.09.008

550 kV GIL 弹簧触指结构的多物理场耦合分析与优化设计

Multi-physics Field Coupling Analysis and Optimal Design of Spring Finger Structure in 550 kV GIL

吴芊婳 1杨昊 1周福升 2高超 2丁瑞芳 1赵杨震1

作者信息

  • 1. 西安工程大学电子信息学院,西安 710600
  • 2. 南方电网科学研究院有限责任公司,广州 510663
  • 折叠

摘要

Abstract

Spring contact finger is critical electrical connecting element in high-voltage electrical equipment,and its performance directly affects the safety and reliability of the equipment.In this paper,the effects of wire diameter,number of spring coils,and the groove angle of the contact base on the performnce of the spring contact finger are in-vestigated,finding that the wire diameter and the groove angle have a significant influence on the electrical contact performance of the contact finger.Increasing the wire diameter can reduce the contct resistance and current density,but may lead to localized overheating.Increasing the groove angle can reduce the contact resistance and contact tem-perature rise,but may result in excessively high current density.To achieve optimal performance,in this paper the NSGA-II multi-objective genetic algorithm is employed for optimization,with the minimal contact temperature rise as the objective The optimization results show that the optimal performance of the contact finger is achieved when the wire diameter is 1.5 mm,the number of spring coil is 135 and the groove angle is 135°.This study reveals the influ-ence of tructural parameters of the spring contct finger on the electrical contact performance and proposes an optimi-zation method based on a multi-objective genetic algorithm,providing a theoretical basis for GIL contact finger struc-tural design and thermal fault analysis.

关键词

弹簧触指/多物理场耦合/接触温升/结构优化/遗传算法

Key words

spring-loaded contact fingers/multi-physics field coupling/contact temperature rise/structural optimisation/genetic algorithm

引用本文复制引用

吴芊婳,杨昊,周福升,高超,丁瑞芳,赵杨震..550 kV GIL 弹簧触指结构的多物理场耦合分析与优化设计[J].高压电器,2026,62(9):69-78,10.

基金项目

国家自然科学基金项目(52007138). Project Supported by National Natural Science Foundation of China(52007138). (52007138)

高压电器

1001-1609

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