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首页|期刊导航|极端制造(英文)|In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics

In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics

Hyunjin Jung Sungjun Yoon Donghee Son

极端制造(英文)2026,Vol.8Issue(4):4-8,5.
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极端制造(英文)2026,Vol.8Issue(4):4-8,5.DOI:10.1088/2631-7990/ae5138

In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics

In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics

Hyunjin Jung 1Sungjun Yoon 2Donghee Son2

作者信息

  • 1. Department of Electrical and Computer Engineering,Sungkyunkwan University(SKKU),Suwon,Republic of Korea||Center for Neuroscience Imaging Research,Institute for Basic Science(IBS),Suwon,Republic of Korea
  • 2. Center for Neuroscience Imaging Research,Institute for Basic Science(IBS),Suwon,Republic of Korea||Department of Chemical and Biomolecular Engineering,Yonsei University(YU),Seoul,Republic of Korea
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摘要

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Hyunjin Jung,Sungjun Yoon,Donghee Son..In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics[J].极端制造(英文),2026,8(4):4-8,5.

基金项目

This research was financially supported by the National Research Foundation of Korea(NRF)Grant funded by the Korea government(MSIT)(numbers RS-2025-02303342 and RS-2025-25424498).This work was also supported by Korea Basic Science Institute(National Research Facilities and Equipment Center)Grant funded by the Ministry of Science and ICT(number RS-2024-00401763).This work was sup-ported by the Yonsei Fellowship,funded by Lee Youn Jae. (NRF)

极端制造(英文)

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