丝绸2026，Vol.63Issue(9)：42-52,11.DOI:10.3969/j.issn.1001-7003.2026.09.005
聚合物基可穿戴传感器封装工艺的研究与应用进展
Research and application progress in packaging processes for polymer-based wearable sensors
摘要
Abstract
Polymer-based wearable sensors are lightweight,soft,stretchable,conformable to the skin,and compatible with large-scale manufacturing,and have therefore been widely used in physiological signal acquisition,human motion recognition,sweat analysis,health monitoring,and human-machine interaction.However,during prolonged skin contact,repeated deformation,sweat exposure,friction,and washing,these devices are susceptible to electrode corrosion,interfacial delamination,disruption of conductive networks,and signal drift.The selection of encapsulation materials and the optimization of encapsulation processes determine not only the waterproofing,sweat resistance,electrical insulation,and mechanical protection of the devices,but also their sensitivity,response time,breathability,moisture permeability,and wearing comfort.Focusing on the service requirements of polymer-based wearable sensors,this review systematically examined recent advances in encapsulation materials and processing technologies,thereby providing reference for the design and application of highly stable,low-drift,and comfortable wearable sensors. The performance characteristics of polydimethylsiloxane,Ecoflex,thermoplastic polyurethane,Parylene C,hydrogels,and inorganic-organic composite materials were compared from five perspectives:mechanical matching,environmental barrier performance,breathability and comfort,interfacial adhesion,and process compatibility.According to the formation mechanisms of encapsulation structures and their processing scales,existing encapsulation technologies were classified into four categories:conventional encapsulation,micro-/nanoencapsulation,three-dimensional printing-based encapsulation,and integrated encapsulation.Specifically,conventional encapsulation primarily includes coating,lamination,and hot pressing,whereas micro-/nanoencapsulation includes micro-/nanoprinting,photolithography and etching,and microcapsule-based encapsulation.By comparing encapsulation temperature,film thickness,patterning resolution,sensitivity,response time,cyclic stability,environmental tolerance,and wearability,the trade-offs among barrier performance,flexibility,breathability,and sensing sensitivity were elucidated.On this basis,a research framework involving the synergistic optimization of encapsulation materials,structural configurations,and processing parameters was proposed.Silicone-rubber encapsulation exhibited a low modulus and favorable skin conformability,but provided limited resistance to water-vapor and ion penetration.Thermoplastic polyurethane(TPU)was suitable for lamination,heat sealing,and large-scale production,although its breathability remained insufficient.Parylene C and inorganic-organic composite films provided excellent barrier properties,but their applications were restricted by large-deformation conditions and relatively high manufacturing costs.Coating-based encapsulation was inexpensive and broadly applicable,but its wear and washing resistance required further improvement.Lamination and hot pressing enhanced interlayer bonding and structural stability,but could damage temperature-sensitive materials.Micro-/nanoprinting and photolithography-etching technologies promoted the miniaturization and precision of encapsulation structures,whereas microcapsule-based encapsulation enabled crack repair and restoration of electrical conductivity.Three-dimensional printing and integrated encapsulation further facilitated the functional integration of sensing,sampling,wireless transmission,thermal management,and self-healing.To achieve coordinated performance matching,encapsulation technologies have gradually evolved from single-purpose protection toward structural regulation and multifunctional integration.Nevertheless,several challenges remain,including lengthy processing chains,high manufacturing costs,interfacial aging,long-term signal drift,and the difficulty of simultaneously ensuring stability and wearing comfort.Future research should prioritize composite encapsulation materials combining a low modulus,high barrier performance,moisture permeability,fatigue resistance,and biocompatibility.Quantitative relationships among encapsulation thickness,interfacial bonding strength,and signal drift should also be established.Based on these relationships,low-temperature,low-pressure,simplified,and roll-to-roll continuous encapsulation processes should be developed to reduce manufacturing costs.Furthermore,self-healing,antifouling,and environmentally responsive mechanisms should be incorporated and combined with digital design and intelligent manufacturing to enable adaptation to complex curved surfaces,self-monitoring of encapsulation conditions,and early warning of device failure,so as to promote the high-consistency,long-service-life,and large-scale application of polymer-based wearable sensors.关键词
聚合物/可穿戴/传感器/封装材料/封装工艺Key words
polymer/wearable device/sensor/packaging material/packaging process分类
轻工纺织引用本文复制引用
贺晓亚..聚合物基可穿戴传感器封装工艺的研究与应用进展[J].丝绸,2026,63(9):42-52,11.基金项目
江西省纺织服装产业科技创新联合体招标课题项目(JFZX-202526) （JFZX-202526）
