电子元件与材料2001，Vol.20Issue(3)：19-22,4.
多芯片组件的热控制技术
Thermal management of multi-chip modules (MCMs).
摘要
Abstract
Thermal control plays a key role in a successful design of MCM. The thermal problems related with MCM are discussed, which are solved by developing an enhanced internal thermal conduction paths and an external cooling system. The techniques used to cool MCM are discussed. Perspective of the high performance thermal control cooling technology for over 20 years are also discussed. (26 refs)关键词
多芯片组件/热控制/热设计/热阻/热流路径/直接浸液冷却分类
信息技术与安全科学引用本文复制引用
罗秀江,陈伟元,王毫才..多芯片组件的热控制技术[J].电子元件与材料,2001,20(3):19-22,4.
