| 注册
首页|期刊导航|电子元件与材料|三苯基膦催化环氧–酚醛树脂的固化反应研究

三苯基膦催化环氧–酚醛树脂的固化反应研究

陈海燕 李锦春 谭伟 杜新宇 吴娟

电子元件与材料2009,Vol.28Issue(8):46-49,4.
电子元件与材料2009,Vol.28Issue(8):46-49,4.DOI:10.3969/j.issn.1001-2028.2009.08.013

三苯基膦催化环氧–酚醛树脂的固化反应研究

Study on cure reaction of epoxy-phenolic aldehyde resin catalyzed by triphenylphosphine

陈海燕 1李锦春 1谭伟 2杜新宇 2吴娟2

作者信息

  • 1. 江苏工业学院,江苏,常州,213164
  • 2. 汉高华威电子有限公司,江苏,连云港,222006
  • 折叠

摘要

Abstract

The cure reaction of epoxy NC-3000L and phenolic aldehyde resin xy-lok system resin catalyzed by triphenylphosphine was studied in both isothermal and dynamic conditions by means of differential scanning calorimeter (DSC). The results show that before the cure extent of 80%, the cure reaction is controlled by chemical kinetics and accords with Kamal selfcatalytic kinetical model. When the cure extent is beyond 80%, the cure reaction alters to diffusion controlling as main mode. The equations of cure reactive kinetics before and after 80% of the cure exetnt are established, respectively. The activity energy of the reaction under dynamic cure condition is 75.04 kJ/mol, which is obtained by Ozawa method.

关键词

环氧–酚醛树脂/固化反应/自催化动力学模型

Key words

epoxy-phenolic aldehyde resin/cure reaction/selfcatalytic kinetical model

分类

信息技术与安全科学

引用本文复制引用

陈海燕,李锦春,谭伟,杜新宇,吴娟..三苯基膦催化环氧–酚醛树脂的固化反应研究[J].电子元件与材料,2009,28(8):46-49,4.

电子元件与材料

OA北大核心CSCDCSTPCD

1001-2028

访问量0
|
下载量0
段落导航相关论文