电子元件与材料2011，Vol.30Issue(2)：25-28,4.
混合稀土对Sn-0.70Cu-0.05Ni钎料组织与性能的影响
Effect of adding mixed RE on microstructure and properties of Sn-0.70Cu-0.05Ni solder alloy
摘要
Abstract
In order to explore the influence of RE (rare earths) on the Sn-0.70Cu-0.05Ni solder alloy, various micro amounts of RE, which are mainly La and Ce, were added into this alloy and their properties were investigated. The results show that adding micro amount of RE could refine the microstructure of the solder alloy and inhibit the growth of intermetallic compounds. Meanwhile, more uniform microstructure, improvements of the wettability and mechanical properties were obtained with RE addition. When the mass fraction of RE reaches 0.10％, the wetting force and tensile strength of the solder alloy are 3.02 mN and 31.3 MPa, respectively. However, the addition of RE could also accelerate the copper dissolution and solder oxidation rate. By analyzing the above results, it could be found that the suitable mass fraction of the RE addition on Sn-0.70Cu-0.05Ni solder alloy is within 0.05％-0.10％.关键词
Sn-0.70Cu-0.05Ni/无铅钎料/混合稀土/溶铜性/力学性能Key words
Sn-0.70Cu-0.05Ni/ lead-free solder/ mixed rare earths/ copper dissolution/ mechanical properties分类
矿业与冶金引用本文复制引用
易江龙,张宇鹏,许磊,刘凤美,杨凯珍..混合稀土对Sn-0.70Cu-0.05Ni钎料组织与性能的影响[J].电子元件与材料,2011,30(2):25-28,4.基金项目
广东省重大科技专项资助项目(No.2009A080204009) （No.2009A080204009）
广州有色金届研究院创新基金资助项目(No.1683018) （No.1683018）
