电子元件与材料2011，Vol.30Issue(2)：39-42,4.
一种醇基低固含量免清洗助焊剂的研制
Development of an alcohol-based low solid content no-clean flux
摘要
Abstract
The effects of active agent and surfactant on the wettability of flux for lead-free solder were studied by performing the spread test and wetting balance test, and an alcohol-based no-clean flux was developed based on the analysis results. For the developed flux, organic acid and organic amine were employed as the active agent and a kind of mixed surfactant was used. The results show that the wettability of the fluxes with mixed surfactant is significantly improved in comparison to the fluxes with single surfactant. The flux using the mixed surfactant composed of Op-4 and nonylphenol polyoxyethylene in a mass ration of 8:1 shows the highest wettability with the maximum wetting force being 6.14 mN. The developed flux is colorless and transparent, does not release pungent smell, contains less than 2％ (mass fraction) non-volatile matter, and shows high wettability and little residue. And, with the application of this flux, the obtained spots are bright and plump.关键词
醇基助焊剂/乙醇/免清洗Key words
alcohol-based flux/ alcohol/ no-clean分类
信息技术与安全科学引用本文复制引用
郑家春,杨晓军,雷永平..一种醇基低固含量免清洗助焊剂的研制[J].电子元件与材料,2011,30(2):39-42,4.基金项目
"十一五"国家科技支撑重点资助项目(No.2006BAE03B02) （No.2006BAE03B02）
