电子元件与材料2011，Vol.30Issue(2)：36-38,3.
SnAgCu无铅焊膏用溶剂的优化研究
Research on the solvents optimization of SnAgCu lead-free solder paste
摘要
Abstract
The optimization of 10 solvents used in SnAgCu lead-free solder paste were carried out by reflow soldering with the spreadability and the spot morphology as the main comment indexes. And the properties of the composite solvents which was mixed by two solvents possessing good performances were studied. The results indicate that the pastes with A alcohol, B ether and triethylene glycol as single solvent have good wettability, plump spots, and the spreadabilities are all over 83％. When ζ(A alcohol: B ether) is 3:2, the solder paste has good anti-slumping ability and the spreadability is above 93％. The appearance of spots is regular, plump, beamy and less surface oxide.关键词
无铅焊膏/有机溶剂/铺展率/回流焊Key words
lead-free solder paste/ organic solvent/ spreadability/ reflow soldering分类
信息技术与安全科学引用本文复制引用
薛静,赵麦群,范欢,张金凤..SnAgCu无铅焊膏用溶剂的优化研究[J].电子元件与材料,2011,30(2):36-38,3.基金项目
陕西省重点学科建设专项资金资助项目 （）
