电子元件与材料2011，Vol.30Issue(6)：53-57,5.
回流次数对Sn3.8Ag0.7Cu-xNi/Ni焊点的影响
Effects of multiple reflows on Sn3.8Ag0.7Cu-xNi/Ni solder joints
摘要
Abstract
The composite lead-free solders Sn3.8Ag0.7Cu-xNi (x=0.5, 1.0, 2.0) were produced, the properties of the solders joints with Au/Ni/Cu pads were studied in different reflow numbers. Results show that the composites solders have optimal wetting ability compared with that of without Ni-adding. The melting point is less than 222 ℃. The intermetallic compounds (IMC) alters from the needle-like (CuNi)6Sn5 of the joint without Ni-adding to dual layers of polyhedron (CuNi)6Sn5 and boomerang shape (NiCu)3Sn4 when x=0.5, and only boomerang shape (NiCu)3Sn4 is formed at the interface between the composite solder and Ni layer when x exceeds 1.0. The shear strength of solder joints is higher than that without Ni-adding.关键词
复合无铅焊料/Sn3.8Ag0.7Cu/金属间化合物/回流Key words
composite lead-free solder/ Sn3.8Ag0.7Cu/ intermetallic compound/ reflow分类
矿业与冶金引用本文复制引用
刘平,顾小龙,姚琲,赵新兵,刘晓刚..回流次数对Sn3.8Ag0.7Cu-xNi/Ni焊点的影响[J].电子元件与材料,2011,30(6):53-57,5.基金项目
浙江省2010年自然科学基金资助项目(No.Y4100809) （No.Y4100809）
