电子元件与材料2011，Vol.30Issue(6)：70-73,4.
层叠封装热疲劳寿命的有限元法分析
Analysis on the thermal fatigue life of PoP using finite element method
摘要
Abstract
A 3-D finite element model of PoP (Package on Package) was built, and the behavior of PoP subjected to thermal cycling was simulated using the finite element method. In the simulation, Anand's visco-plasticity constitutive equation was used to describe the mechanic behavior of SnAgCu solder balls. The fatigue life of the most dangerous solder balls was calculated using the Coffin-Masson formula modified by Engelmaier. The results show that the stress in the balls of the bottom array is higher than that in the balls of the top array. The most dangerous solder balls locate in comers of the bottom array, and their fatigue life is calculated to be 791 cycles.关键词
层叠封装/有限元法/热疲劳寿命Key words
Package on package (PoP)/ finite element method/ thermal fatigue life分类
信息技术与安全科学引用本文复制引用
任超,罗成,谢秀娟,丁俊,徐文正..层叠封装热疲劳寿命的有限元法分析[J].电子元件与材料,2011,30(6):70-73,4.基金项目
航空科学基金资助项目(No.20090246001) （No.20090246001）
