电子元件与材料2011，Vol.30Issue(5)：68-71,4.
La对SnAgCu/Cu及Ni界面金属间化合物的影响
Effect of La addition on the IMC of SnAgCu/Cu and Ni
摘要
Abstract
The formation and growth of intermetallic compounds (IMC) for Sn0.3Ag0.7Cu-xLa/Cu (x ＝ 0-0.25) and Ni were studied with the scanning electron microscope and the energy dispersive X-ray detector. The results indicate that the grain size of Cu6Sn5 in the soldering point/Cu interface is obviously refined with La addition after reflowing and aging.When x surpasses 0.10, numerous grains of Ag3Sn appear on the top of Cu6Sn5 grain, and the surface of Cu6Sn5 becomes coarsing and emerges many. holes. When x is 0.07, the thickness of IMC changes relatively stable with increment of the aging time and is minimum after 300 h aging. The optimum addition of w(La) is 0.07％.关键词
Sn0.3Ag0.7Cu-xLa/金属间化合物/钎焊Key words
Sn0.3Ag0.7Cu-xLa/ intermetallic compound/ soldering分类
矿业与冶金引用本文复制引用
王佳,王丽凤,刘学..La对SnAgCu/Cu及Ni界面金属间化合物的影响[J].电子元件与材料,2011,30(5):68-71,4.基金项目
黑龙江省自然科学基金资助项目(No.E200915) （No.E200915）
