电子元件与材料2011，Vol.30Issue(5)：72-76,5.
Sn基焊料/Cu界面IMC形成机理的研究进展
Progress of study on formation mechanism of IMC at the interface between the Sn-based solder and Cu substrate
摘要
Abstract
The brittle Cu6Sn5 and Cu3Sn etc. are common intermetallic compounds (IMC) forming at the Sn-based lead-free solder/Cu substrate interface. The Cu6Sn5 and Cu3Sn layers will strongly influence the mechanical behavior and reliability of solder joints, the studies of IMC can help to understand its forming nature, then to control its form and growth, so as to improving properties of solder joints. The near study results are reviewed, in most cases, Cu6Sn5 precipitates in scallop-shaped grains either at the S-L (solid/liquid) interface or the S-S interface, while Cu3Sn is always uniform thin layer. Thermodynamic studies show that the formation of IMC is controlled by diffusion. Different alloy element has unlike effect on the formation and growth of the Cu6Sn5 through changing the driving form force △G of it. In contrast to conventional Pb-Sn solders, lead-free solders are easier to form IMC, which results in premature failures of solder joints.关键词
Sn基无铅焊料/金属间化合物/综述/可靠性Key words
Sn-based lead-free solder/ intermetallic compound/ review/ reliability分类
信息技术与安全科学引用本文复制引用
刘雪华,唐电..Sn基焊料/Cu界面IMC形成机理的研究进展[J].电子元件与材料,2011,30(5):72-76,5.基金项目
国家"863"资助项目(No.2007AA03Z325) （No.2007AA03Z325）
福建省发改委"发明创造"专项资助项目 （）
