电子元件与材料2011，Vol.30Issue(3)：55-57,3.
低熔点SnBi合金对导电银胶性能的影响
Effect of low melting point eutectic SnBi alloy on properties of Ag-based conductive adhesive
万超 1王宏芹 1王玲 1杜彬 1王鹏程 1符永高1
作者信息
- 1. 中国电器科学研究院,广东,广州,510300
- 折叠
摘要
Abstract
The conductive adhesives composed by selecting epoxy resin system, Ag powder as main conductive filler with addition different masses of low melting point eutectic SnBi alloy were fabricated and its conductive and mechanical properties were investigated by the four point probe method and the universal material testing machine. It is found that when w(SnBi) keeps at 15％, the bulk resistivity and the shear strength of the adhesive reach 3.4× 1 0-4 Ω ·cm and 12.56 MPa, respectively. The addition of SnBi alloy not only improves the conductivity, but also increases the mechanical property of the connection.关键词
导电银胶/SnBi合金/剪切强度Key words
conductive adhesive/ eutectic SnBi alloy/ shear strength分类
信息技术与安全科学引用本文复制引用
万超,王宏芹,王玲,杜彬,王鹏程,符永高..低熔点SnBi合金对导电银胶性能的影响[J].电子元件与材料,2011,30(3):55-57,3.
