电子元件与材料2011，Vol.30Issue(3)：58-60,68,4.
SnAgCu无铅焊点原位电迁移IMC演变
Intermetallic compound evolution induced by electromigration in situ for SnAgCu lead-free solder joint
摘要
Abstract
At 28 ℃ and direct current of 3.25A, the electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu solder jont was investigated in situ. Micrographs of cross-section of joint were observed after current acting time of 120, 168, 384 and 504 h. Results show that Cu6Sn5 IMC spreads over all section of the joint in the early electromigration. As time goes on,IMC migrates from the cathode to the anode continuously. After current acting 504 h, there is no IMC inside solder joint, IMC layers is about 20 μm and 8 μm at the anode the cathode, respectively. The polarity effect appears at the interface obviously.关键词
原位电迁移/金属问化合物/Sn3.0Ag0.5CuKey words
electromigration in situ/ intermetallic compound/ Sn3.0Ag0.5Cu分类
矿业与冶金引用本文复制引用
常红,李明雨..SnAgCu无铅焊点原位电迁移IMC演变[J].电子元件与材料,2011,30(3):58-60,68,4.基金项目
广东省科技计划资助项目(No.2008A080403008-04) （No.2008A080403008-04）
