电子元件与材料2011，Vol.30Issue(4)：56-58,3.
BGA元器件受热模型分析与SMT工艺控制
Thermal model analysis and SMT process control of BGA components
摘要
Abstract
There were different solder ball heating pathes and thermal resistances of components of different BGA packaging structure in the refiow process, it caused that solder balls was being heated unevenly and PCB deformation as well as "virtual contact" of IC chips, these defects seriously affected the quality of soldering. Through the analysis of BGA packaging components thermal model and the thermal resistance, different BGA package components reflow temperature settings and control points are proposed, the effects are best with peak temperature in 235-245 ℃ for 10-15 s for PBGA components and peak temperature in 235-245 ℃ for 15-20 s for CBGA components.关键词
BGA元器件/SMT工艺/热阻/回流焊Key words
BGA component/ SMT process/ thermal resistance/ reflow分类
信息技术与安全科学引用本文复制引用
王亚盛..BGA元器件受热模型分析与SMT工艺控制[J].电子元件与材料,2011,30(4):56-58,3.
