电子元件与材料2009，Vol.28Issue(11)：48-51,4.DOI:10.3969/j.issn.1001-2028.2009.11.014
晶圆尺寸级封装器件的热应力及翘曲变形
Research on the thermal stress and warpage of WLCSP device
摘要
Abstract
The sizes and material parameters of wafer level chip scale package(WLCSP) device would have an influence on the reliability of WLCSP. A WLCSP device of EPS/APTOS was studied by the finite element analysis software. The results show that the chip thickness, BCB thickness, the height of up pad and PCB board thickness have evident effect on the thermal stress. The thermal stress increases 21.60 MPa when the chip thickness increases from 0.25 mm to 0.60 mm. And PCB thickness influenced mainly by the warpage. The warpage of WLCSP decreases by 20% when the thickness increases PCB from 1.0 mm to 1.6 mm.关键词
晶圆尺寸级封装/热应力/翘曲变形/器件结构尺寸Key words
WLCSP/ thermal stress/ warpage/ device structure sizes分类
信息技术与安全科学引用本文复制引用
牛利刚,杨道国,李功科..晶圆尺寸级封装器件的热应力及翘曲变形[J].电子元件与材料,2009,28(11):48-51,4.基金项目
国家自然科学基金资助项目(No. 60666002) （No. 60666002）
