电子元件与材料2011，Vol.30Issue(8)：48-51,4.
电子封装用环氧树脂基复合材料的优化
Modification of epoxy resins composites for electronic packaging
李攀敏 1钟朝位 1童启铭 1庞祥1
作者信息
- 1. 电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054
- 折叠
摘要
Abstract
The effect of different amounts of 593 curing agent on epoxy resin E-51 and silane coupling agent on epoxy resin E-51/AI2O3 composites were studied through experiments. The results show that composites have higher density, less pores and better forming effect when the mass ratio of 593 curing agent and epoxy resin is 1:4. Thermal conductivity of the composite reaches 0.75 W/(m · K) as the mass fraction of KH-560 is 8%.关键词
电子封装/环氧树脂/复合材料Key words
electronic packaging/ epoxy resin/ composites分类
信息技术与安全科学引用本文复制引用
李攀敏,钟朝位,童启铭,庞祥..电子封装用环氧树脂基复合材料的优化[J].电子元件与材料,2011,30(8):48-51,4.
